深圳pcb制板-高TG主板

Release time：2019-03-29 Editor author：Jin Zhi Zhu Read：9914

特點：深圳pcb制板該項目需壓接工藝，對壓接孔徑公差要求嚴格，公差+/-0.05mm

層數：12 層

板材：高TG FR4

板厚：2.0mm

單板大小：292X249.6mm

表面處理工藝：沉金

銅厚：1OZ（其中內層銅厚需陰陽銅配對）

線寬/線距：4/4mil

孔徑：0.2mm

阻抗控制：10% 油墨 深圳pcb制板

Previous：PCB制板-高TG半孔板

Statement: This article originates from the integration of Jin Zhizhuo's official website, such as copyright issues related to articles and manuscripts. Please contact us in time, and we will deal with them as soon as possible.
Title: Temperature Detection Method for Temperature Control Switches web：http://www.iweekmall.com/news/12.html

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